led array la38b-65/y ligitek electronics co.,ltd. property of ligitek only data sheet a la38b-65/y 03 - feb - 2005 doc. no : qw0905- rev. : date :
- + 0.5 typ 4.0 1.0min 4.2 10.20.5 5.2 5.0 ly2040 5.2 4.2 4.0 3.0 2.54typ 1.0min ?? 0.5 typ 25.0min 1.5max 4.0 3.0 ligitek electronics co.,ltd. property of ligitek only package dimensions part no. page 1/4 la38b-65/y note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
la38b-65/y ligitek electronics co.,ltd. property of ligitek only unit y ratings mw ma g a 80 60 10 ir 20 ma page 2/4 j j -40 ~ +100 max 260 j for 5 sec max (2mm from body) peak 20 36 min. min. max. 2.6 8.0 1.7 p lens 585 35 typ. luminous intensity @ ma(mcd) viewing angle 2 c 1/2 (deg) spectral halfwidth ??f nm wave length f nm forward voltage @20ma(v) 10 -40 ~ +85 parameter power dissipation peak forward current duty 1/10@10khz reverse current @5v forward current part no. storage temperature soldering temperature emitted yellow la38b-65/y gaasp/gap material part no operating temperature yellow diffused color note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. absolute maximum ratings at ta=25 j i fp pd i f tstg t opr tsol symbol typical electrical & optical characteristics (ta=25 j )
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-20 0 204060 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 700 y chip part no. page3/4 la38b-65/y
la38b-65/y ligitek electronics co.,ltd. property of ligitek only reference standard description reliability test: test item test condition the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. operating life test high temperature storage test low temperature storage test 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 part no. page 4/4 the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test thermal shock test solder resistance test 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles 1.ta=65 j? 5 j 2.rh=90 %~95 % 3.t=240hrs ? 2hrs this test intended to see soldering well performed or not. solderability test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1
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